Blend of a polyphenylene ether and a styrene resin



y 1968 E. P. CIZEK 3,383,435

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INVENTOR. ERIC P. CIZEK ATTORNEYS HEAT DISTORTION TEMPERATURE y 14, 1968 E. P. CIZEK 3,383,435

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6,000 I l l I 2,000 L I 0 2O 4O 6O 80 I00 0 2O 4O 6O 80 I00 WEIGHT "/0 POLYPHENYLENE ETHER WEIGHT FDLYPHENYLENE ETHER a 300 90 E A g 250 a BC) *5 f; 2 \J 200 Tn '70 2 CI LU Q5: g I .1 IOO d 50 2 z 0. Y. 2 U 50 O 40 m (It 1 I!) Z o I l l l l 1 n E 0 2O 4O 6O I00 0 6O 4O 6O 80 I00 WEIGI'I'I FOLYPHENYLENE ETHER WEIGHT FOLYPHENYLENE ETHER INVENTOR. ERIC P. CIZEK ATTO RN EYS y 1968 E. P. CIZEK 3,383,435

BLEND OF A POLYPHENYLENE EITHER AND A STYRENE RESIN Filed Aug. 11, 1967 5 Sheets-Sheet 5 x Z; V 3.6

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INVENTOR. ERIC P. CIZEK BYKM z. 21%

ATTDRNEYS Unit 3,383,435 BLEND BF A PGLYPHENYLENE ETHER AND A dT'YRENE RESEN Eric P. Qiaeh, Ann Arbor, Mich, assignor to General Eiectric (Iornpany, a corporation of New York Continuation-impart of appiication Ser. No. 423,762, fan. 6, 1965. This application Aug. 11, 1967, Ser. No. 659,961

23 Claims. (Cl. 269 874) ABSTRACT 5F THE EESCLVZESURE introduction This application is a continuation-in-part of copending United States patent application Ser. No. 423,702, filed Jan. 6, 1965, now abandoned.

This invention relates to a thermoplastic composition comprising a blend of a styrene resin and a polyphenylene ether; the blend possessing many properties improved over those of either the styrene resin or polyphenylene ether.

Background of the invention The polyphenylene others are known and described in numerous publications including US. Patents Nos. 3,306,874 and 3,306,875 of Allan S. Hay and US. Patents Nos. 3,257,357 and 3,257,358 of Gelu Stoefi Stamatoff. The hi h molecular weight polymers are high per formance engineering thermoplastics possessing relatively high melt viscosities and softening pointsi.e., in excess of 275 C., and are useful for many commercial applications requiring high temperature resistance including formation of film, fiber and molded articles. For many uses, the high performance properties are not necessary and the relatively high melt viscosities and softening points are a disadvantage. For example, film and fiber can only be formed on a commercial scale from solution; melt processing being commercially unattractive because of the required high temperatures needed to soften the polymer and the problems associated therewith such as instability, discoloration and the requirement for specially designed process equipment to operate at elevated temperatures. Molded articles can be formed by melt processing techniques, but again, the high temperatures required are undesirable.

Polystyrene, because of low cost and an overall combination of fair to good properties, has found wide and (1 States Patent 0 3,333,435 Patented May 14, 1968 diversified commercial acceptance. However, polystyrene is brittle, possesses a relatively low heat distortion temperature and has relatively poor resistance to the more common organic solvents. It is known in the art that various properties of polystyrene may be improved by copolymerizing monomeric styrene with other monomers or by blending polystyrene with other resins. For example, polystyrene is frequently blended with rubber to overcome the disadvantage of brittleness. Solvent resistance has been imparted to polystyrene by copolymerization of monomeric styrene with acrylonitrile. Butadiene has been grafted onto styrene-acrylonitrile copolymers for added flexibility. Heretofore, modification of polystyrene in the above described manner has resulted in improvement in one or a few specific properties rather than in a general upgrading of the polymer.

Statement of the invention The present invention provides a means for simultaneously upgrading many properties of polystyrene and improving the moldability of the polyphenylene ethers and is predicated upon the discovery that the polyphenylene ethers and polystyrene, including the modified polystyrenes as disclosed above, are combinable in all proportions re sulting in thermoplastics compositions having many properties improved over those of either the polyphenylene ether or polystyrene alone.

As an additional advantage to this invention, it has been found that blending of polystyrene with many of the polyphenylene ethers allows for custom formulation of compositions having predetermined properties ranging between those of polystyrene and those of the polyphenylene ether by controlling the ratio of the two components. This is unexpected because blending of two polymers usually results in a composition displaying two distinct sets of propertiesi.e., one for each of the resinous components.

As a further advantage of this invention, it has been found that blending a modified polystyrene with a polyphenylene ether provides a composition exhibiting the improvement resulting from modification of the polystyrene. For example, a blend of a polyphenylene other with a styrene-acrylonitrile copolymer has a resistance to organic solvents superior to that of a blend formed from a polyphenylene ether and polystyrene.

Accordingly, an object of this invention is to provide a thermoplastic composition comprising a polyphenylene ether and a styrene resin where the disadvantages inherent in each of the polymers are substantially overcome.

Description of the invention The polyphenylene ethers with which this invention is concerned are those having the repeating structural unit of the formula:

Q Q l l wherein the oxygen ether atom of one unit is connected to the benzene nucleus of the next adjoining unit, n is a positive integer and is at least 100, and each Q is a monovalent substituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary a-carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary cit-carbon atom, hydrocarbonoxy radicals being free of a tertiary a-carbon atom, and halohydrocarbonoxy radicals having at least 2 carbon atoms between the halogen atom and 'phenyl nucleus and being free of a tertiary rx-CHDbOn atom. Examples of suitable polymers may be found in the above referenced patents of Hay and Stamatoff.

The preferred polyphenylene ethers are those having alkyl substitution ortho to the oxygen ether atom and most preferably, ortho methyl substitution. These polymers are preferred because they combine with polystyrene to form fully compatible, homogeneous, mixtures.

The styrene resin is one having at least 25 percent, by weight, polymer units derived from the compound having the formula:

where R is hydrogen, lower alkyl or halo-gen; Z is a member selected from the class consisting of vinyl, hydrogen, chlorine and lower alkyl; and p is a whole number equal to from to 5. The term styrene resin as used throughout this disclosure and in the claims, and defined by the above Formula II includes, by way of example, homopolymers such as polystyrene and polychlorostyrene, the modified polystyrenes such as rubber modified polystyrenes, and the styrene containing copolymers such as the styreneacrylonitrile copolymers (SAN), styrenebutadiene copolymers, styrene-acrylonitrile-ot-alkyl styrene copolymers, styrene acrylonitrile butadiene copolymers (ABS), poly-ot-methylstyrene, copolymers of ethylvinylbenzene and divinylbenzene, and the like. The preferred styrene resins are the high impact polystyrenes, the ABS copolymers and the SAN copolymers.

The method of blending the polyphenylene ether with the styrene resin is not critical and does not constitute a part of this invention. The preferred method comprises blending the two polymers in power or granular form,

extruding the blend, chopping into pellets and re-extrud- As noted above, the polyphenylene ethers and the styrene resins are combinable with each other in all proportions. Consequently, compositions comprising from 1 to 99 percent, by weight, polyphenylene ether and from 99 to 1 percent, by weight, styrene resin are included within the scope of the invention. In general, compositions containing from 40 to 85 percent polyphenylene ether and from 60 to percent styrene resin exhibit the best overall combination of properties and these compositions are preferred.

The benefits obtained by blending a styrene resin with a polyphenylene ether are illustrated in the following examples which are set forth as further description of the invention, but are not to be construed as limiting the invention thereto.

Unless otherwise indicated, all blends were prepared having compositions varying from 100 percent polyphenylene ether and 0 percent styrene resin to 100 percent styrene resin and 0 percent polyphenylene ether by passing mixtures .of the polymers through a variable pitch, single-screw extruder with extrusion temperature maintained between 450 and 550 F. dependent upon the particular polymers used. The strands emerging from the extruder were cooled, chopped into pellets, re-extruded,

chopped into pellets and molded into test bars using standard procedures.

Example 1 Blends were prepared of a poly-(2,6-dimet-hyl-l,4- phenylene) ether, available under the trademark. PPO from General Electric Company and a crystal polystyrene, available under the trademark Styron-666 from the Dow Chemical Company. The properties of the blend are illustrated in FIGS. 1 to 11 of the drawings wherein:

FIG. 1 represents the relationship between concentration and glass transition temperature for the blends. The single valued relationship is unexpected as normally, blending of two resins results in a composition exhibiting two distinct and separate glass transition temperatures, one for each of the components of the blend. For example, glass transition temperature for a blend of a polyamine and a polystyrene would be as depicted in FIG. 2 of the drawing. The single valued relationship obtained for the blend of the polyphenylene ether and polystyrene is believed to be due to the formation of a single phase or solid solution of the two polymers over their entire concentration range. This is highly unexpected and believed to be unique to the poly-(2,6-di-lower-alkyl-l,4- phenylene) ether crystalling polystyrene systems. Substitutions of other polyphenylene ethers for the poly-(2,6- dialkyl lA-phenylene) ethers or other styrene resins for crystal polystyrene will provide compositions with properties improved over those of crystal polystyrene and melt viscosities below that of the polyphenylene ether.

FIG. 3 illustrates the relationship between he'at distortion temperature and composition determined using the procedures of ASTM D648 at 264 p.s.i. The single valued relationship allows for selection of a composition having a predetermined heat distortion temperature by regulation of the concentration of each component in the blend. For example, if a composition having a heat distortion temperature of C. is desired, it may be obtained from a composition having about 60 percent polyphenylene ether and 40 percent polystyrene. Consequently, blends having molding properties between that of the polyphenylene ether and polystyrene can be custom formulated.

FIG. 4 represents the relationship between composition and fiexural strength determined using the procedures of ASTM D790.

FIG. 5 represents the relationship between composition and compressive strength determined using the procedure set forth in ASTM D695.

FIG. 6 illustrates the relationship between composition and tensile strength determined using the procedure set forth in ASTM D638 at yield point.

FIG. 7 represents the relationship between composition and Rockwell hardness determined using the procedure set forth in ASTM D785.

FIG. 8 represents the relationship between composition and fiexural modulus determined using the procedure of ASTM D740.

FIG. 9 represents the relationship between composition and Izod impact strength determined using the procedure 1s)et forth in ASTM D256 with a notched one-quarter inch FIG. 10 represents the relationship between composition and dissipation factor determined at 60 cycles per second and 23 C. using the procedure of ASTM D150.

FIG. 11 represents the relationship between composition and dielectric constant determined at 60 cycles per second and 23 C. using the procedures of ASTM D150.

All of the above figures illustrate the single valued relationship between composition and property. Of significance with respect to FIGS. 4 to 7 is the disproportionate improvement in properties of the blend over its components for a major portion of the concentration range; the blend exhibiting a property maxima in excess of that of either component. For example, in FIG. 4 compositions containing in excess of about 30 percent polyphenylene ether have flexural strengths in excess of the flexural strength of either polystyrene or the polyphenylene ether.

As an additional advantage to the blend, it was found that polystyrene addition increases melt stability of the polyphenylene ether with melt viscosity of the blend remaining substantially constant at elevated temperatures. The melt viscosity of the polyphenylene ether alone in creases substantially at temperatures in excess of 300 C.

Examples 2-6 Substitution of other polyphenylene ethers having 2,6- dialkyl substitution on the phenylene nucleus for 2,6- dimethy1-l,4-phenylene ether will provide compositions having properties similar to the properties exhibited by the composition of claim 1. Exemplary of other 2,6- dialkyl substituted polyphenylene ethers are: poly-(2,6-diethy'l-1,4-phenylene) ether poly-(2-methyl-6-ethyl-1,4-phenylene) ether poly-(2-methyl-6-propyl-1,4-phenylene) ether poly-(2,6-dipropyl-1,4-phenylene)ether poly-(2-ethy1-6-propy1-1,4-phenylene) ether As the length of the side chain increases, the solid solution is lost and the blend forms two separate phases. The single valued relationship between composition and properties begins to disappear over the mid-portions of the concentration range.

Because single phase systems are formed using 2,6- lower alkyl substituted polyphenylene ethers and polystyrene, blends of these components constitute a preferred embodiment of this invention with the composition formed from poly-(2,6-dimethyl-1,4-phenylene) ether and polystyrene being the most preferred embodiment of the invention.

Example 7 The procedure of Example 1 was repeated with the substitution of a rubber modified high-impact polystyrene identified as Lustrex HTS 8-1 of Monsanto Chemical Company for Styron-666. The results obtained are illustrated in FIGS. 12 to 18 wherein:

FIG. 12 represents the relationship between composition and heat distortion temperature determined using the procedure of ASTM D648 at 264 p.s.i.

FIG. 13 represents the relationship between composition and fiexural strength determined using the procedure of ASTM D790.

FIG. 14 represents the relationship between composition and tensile strength determined using the procedures of ASTM D635.

FIG. 15 represents the relationship between composition and tensile impact strength determined using the procedure of ASTM D1822.

FIG. 16 represents the relationship between composition and Rockwell hardness determined using the procedure of ASTM D785.

FIG. 17 represents the relationship between composition and flexural modulus determined using the procedure of ASTM D740.

FIG. 18 represents the relationship between composition and impact strength determined using the procedure of ASTM D256 with a notched one-quarter inch bar.

As illustrated by the drawings, blends of the poly-- phenylene ether and a high impact polystyrene exhibit a property maxima in excess of that of either component for much of the concentration range. Also, the relationship between composition and property is single valued indicating formation of a single phase.

Example 8 Substitution of poly-a-methylstyrene for crystal polystyrene yields a blend having properties comparable to those depicted in Example 1.

Example 9 A composition was prepared containing approximately 50 percent, by weight, poly-(2,6-dimethyl-1,4-phenylene) G ether, 40 percent, by weight, crystal polystyrene, and 10 percent, by weight, butadiene rubber. The fol-lowing table represents a property profile for the composition:

Property ASTM Procedure Value 8, 000 6, 900 Tensile Elongz on, 38 Shear Strength, psi. 8, 000 Flexural modulus, p.s.i., 73 F 300. 000 Water Absorption, Percent, 24 hrs. 73 F 0. 14 Tensile Stress Relaxation, Percent 31.0

Reduction, 15 hrs. at 5,000 p.s.i. Rockwell Hardness M scale D785 50 Taber Abrasion, 1,000 grs., 10,000 cycles, D1044 35 mg. Mold Shrinkage, in./in D1290 0.007 Izgd Impact Strength, ft. lbs./in., 34; D256 5.5

ar. Melt Viscosity, poise 1,500 seer... 700 Meet Distortion 'lernperature 264 p.s.i. 122 Flammability Compressive strength, p.s.i.... D695 10, 500 Coellicient of Linear 'lhennal Expan- D696 4. 3

sion, in./iu. F. X10- Are Resistance, Sees D495 75 Dielectric Strength, v.p.m. D149 1 720 Volume Resistivity, ohm em D 1. 017 Dielectric Constant, 50% RH, 73 F. D150 2.

60 e.p.s. Dissipation Factor, 50% RH, 73 F. D110 0. 0007 1 Self-extinguishing.

Example 10 Samples were prepared from a poly-(2,6-dimethyl-l,4- phenylene)-ether and a styrene-acrylonitrile copolymer (SAN) containing 27 percent acrylonitrile units and 73 percent styrene units and identified by the trademark TYRIL 767 by Dow Chemical Company. The polyphenylene ether and the SAN copolymer, both in fine granular form, were tumbled in a drum for a period of 24 hours at relatively high speed. The resultant mixture was extruded at a temperature of approximately 600 F. into a water bath. The cooled, extruded strands were chopped into pellets and molded into test bars measuring 2/2 inches by /1 inch by Ms inch, using a Newbury Press at a temperature varying between 430 F. and 575 F. dependent upon sample composition, and a mold temperature of 200 F.

Acrylonitrile is copolymerized with styrene to improve the resistance of the styrene resins to organic solvents. Combination of the SAN copolymers with the polyphenylene ethers results in compositions having many of the benefits obtained from polystyrene as well as improved resistance to organic solvents, though the presence of acrylonitrile in the chain causes the formation of a two-phase blend, each phase readily detectible in compositions containing less than 70 percent of the polyphenylene ether.

To determine the environmental craze-resistance of the molded bars formed from the blend of the polyphenylene ether and SAN copolymer, samples were immersed for 3 minutes in an organic solvent known to be detrimental to the polyphenylene ethers. A strain was placed on each immersed sample and the maximum level of strain which can be applied to a sample in each environment for 3 minutes without developing craze or stress-cracking is determined. The formulations tested and the environmental testing results are set forth in the following table:

Sample Composition Wt. Maximum Strain Identi- Percent Poly- SAN fieation phenylene Ether Gasoline Heptane l Craze/no strain.

The maximum strain in all cases necessary to cause either cracking or crazing increased as the concentration of the SAN copolymer increased. With SAN content equal to zero, the part crazed without strain on the samples.

The following table illustrates various physical properties of the above polymer blends, all measured using standard ASTM procedures.

8 The data is somewhat erratic, but does establish that the presence of ABS in the formulation results in compositions having resistance to aggressive organic environments improved over the resistance of either the polyphenylene ether or polystyrene.

Example 12 Substitution of optically clear A BS for ABS yields a blend having properties comparable to those depicted in Maximum Strain 1 Craze/n strain.

s. l. 11,.tD't1't' T 'lSt Fl. -.1 Idon iiii c aiiou 'fiinipiz ra iuig t d ii uptiir e StdciiiEtit, 10 Example C. p.s.1.Xl0- p.s.1. 10* Examples 13 to 17 iiiI Compositions comprising a poly-(2,6-dimethyl-l,4- 191 107 L6 phenylene) ether and any of the following styrene resins 192 10.9 1.0 1 100 11,0 1, will have physical properties similar to those of Examp e 138 11.0 1.3 0; 155 11.2 1.0 $3 Styrene-e-methylstyrene copolymer 115 11.5 1.8 Styrene-coumarine-indene copolymer 1, fig {g Styrene-methylmethacrylate copolymer 2O Poly-a-chlorostyrene Example Styrene-acrylonitrile-ot-methylstyrene copolymers Butadiene is copolymerized with styrene and styrene E l 18 t 34 acrylonitrile mixtures to impart flexibility to polystyrene C 0 l t d of th and SAN copolymers respectively. It has been found that r f n P fi p0 i an 3 styrene resins containing but-adiene increases the fieX- g P831) g i f tea lymo ibility of blends with the 'polyphenylene ethers. abet ant 6 P0 yp any em 6 er a Samples were prepared from a poly-(2,6-d-imethyl-L4- poly-(2,6-dilauryl-1,4-phenylene) ether phenylene)-ether and an ABS copolymer containing 16 poly-(2,6-diphenyl-1,4-phenylene) ether percent acrylonitrile units, 41 percent styrene units, and poly-(2,6-dimethoxy-1,4-phenylene) ether 43 percent butadiene units. The polyphenylene ether and poly-(2,3,6-trimethyl-1,4-phenylene) ether the ABS, both in fine, granular form, were tumbled in a poly-(2,3,5,6-tetrapropyl-l,4-phenylene) ether drum 'for a period of 3 to 4 hours at relatively high poly-(2,6-diethoxy-1,4-phenylene) ether speeds. The resulting mixtures were extruded at .a tempoly-(2-methoxy-6-ethoxy-1,4-phenylene) ether perature of approximately 600 F. into a water bath. poly-(2-ethyl-5-stearyloxy-1,4-phenylene) ether The cooled extruded strands were chopped into pellets poly-(2,6-dichloro-1,4-phenylene) ether and molded into test bars measuring 2 /2 inches by /2 poly-(2,3-dimethyl-5-chloro-1,4-phenylene) ether inch by 41 inch, using a Newbury Press at a temperapoly-(2-methyl-6-phenyl-1,4-phenylene) ether ture varying between 530 F. and 575 F., dependent poly-(2,6-dibenzyl-1,4-phenylene) ether 'upon the sample composition, and a mold temperature poly-(3-chloro-1,4-phenylene) ether of 200 F. poly-(3,5-diethyl-1,4-phenylene) ether The following table illustrates various physical proppoly-(3-ethoxy-1,4-phenylene) ether erties of the polymer blends, all measured using standard poly-(2-chloro-1,4-phenylene) ether ASTM procedures. poly-(2,5-dibromo-1,4-phenylene) ether Composition Tensile Sample Wt. Percent Heat Distor- Tensile Flex. Stress, Identification Iolyphcnylene ABS tion Tcn1p., Elongation Stren th, Percent Ether 0/264 p.s.i. to Rupture p.s.i.Xl0" Rupture,

p.s.i.Xl(J- 100 0 185 05 1.00 9.3 5 179 1. 5s a 9.4 90 10 177 1. 52 9. 7 s5 15 175 1. 45 10. 2 s0 20 170 1. 40 10. 4 75 25 172 1. 40 10.0 70 30 103 1. 37 10. 5 05 35 170 1. 3s 11. 2 50 50 140 130 1.30 25 75 112 1.12

To determine the environmental craze resistance of the Because of their excellent physical, mechanical, chemmolded bars, samples were submerged for three minutes ical, electrical, and thermal properties, the polymer blends in an organic liquid known to be detrimental to the polyof this invention have many and varied uses. For exphenylene ethers. A strain was placed on each immersed 60 ample, they can be used in molding powder formula- Ple and the maximum level of strain which. can be tions, either alone or mixed with other polymers such pp to a Sample in each environment for 3 minut s, as the polyolefine and may contain various fillers, such wit developing craze Or Stress cracking w deteras wood flour, diatomaceous earth, carbon black, silica, mined. The formulations tested and the environmental em, to make molded parts, such as spur, helical, Worm testing results are set forth in the following table: 65 or bevel gears, ratchets, bearings, cams, impact parts,

gaskets, valve seats for high pressure oil and gas systems or other chemical fluids requiring resistance to chemicals, etc. They can be used to prepare molded, calendered, or extruded articles, films, coatings, threads, filaments, tapes and the like. They can be applied to a broad spectrum of uses in the form of sheets, rods, tapes, etc. and are useful in electrical applications, such as in cable terminals, terminal blocks, backing for electrical circuits, as components of dynamoelectric machines that operate at high temperatures, etc. Films of these materials can be prepared by suitable means, such as by calendering, extrusion, etc. These films are useful as metal or fiber liners, containers, covers, closures, electrical insulating tapes, as sound recording tapes, magnetic tapes, photographic films, pipe and wire tapes, etc. As a coating material, they can be applied as a solution or suspension to any convenient foundation where a surface possessing their excellent properties is desired. They can be used as an encapsulation material, for electrical insulation, for example, as a wire enamel, potting compound, etc. Fibers produced from the polymers can be woven into fabrics, useful in many applications, for example, as filter cloths Where high chemical and heat-resistance is desired. Their excellent electrical properties make laminates of this material useful for electrical equipment, such as slot wedges in the armature of an electric motor, panel boards for printed circuits, electrical appliance panels, radio and television panels, small punched electrical pieces, transformer terminal boards, transformer coil spacers, etc. The polymers may also be mixed with various fillers, modifying agents, etc. such as dyes, pigments, stabilizers, plasticizers, etc.

Obviously, other modifications and variations of the present invention are possible in the light of the above teachings. It is, therefore, to be understood that changes may be made in the particular embodiments of the invention described which are within the full intended scope of the invention as defined by the appended claims.

I claim:

1. A thermoplastic blended composition consisting essentially of (a) from 1.0 to 99 per cent of a polyphenylene ether of the formula i I i O I- Q. Q ..i

where the oxygen ether atom of one unit is connected to the benzene nucleus of the next repeating unit, n is a positive integer and is at least 100, and each Q is a monovalent substituent selected from the group consisting of hydrogen, halogen, hydrocarbon radicals free of a tertiary a-carbon atom, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary tit-carbon atom, hydrocarbonoxy radicals being free of a tertiary a-carbon atom, and halohydrocarbonoxy radical having at least 2 carbon atoms between the halogen atom and phenyl nucleus and being free of a tertiary a-carbon atom; and

(b) from '99 to 1.0 percent of a styrene resin having at least 25 percent polymer units derived from the compound having the formula where R is selected from the group consisting of hydrogen, lower alkyl and halogen, Z is a member selected from the group consisting of hydrogen, lower alkyl, chlorine and vinyl, and p is a whole integer equal to from 1 to 5.

2. The composition of claim 1 where the polyphenylene ether is a poly-(2,6-dialkyl-1,4-phenylene) ether.

3. The composition of claim 1 where the polyphenylene ether is a poly-'(2,6-dimethyl-1,4-phenylene) ether.

4. The composition of claim 1 Where the polyphenylene ether is poly-(2,6-diethyl-1,4-phenylene) ether.

5. The composition of claim 1 Where the polyphenylene ether is poly-'(2,6-diphenyl-1,4-phenylene) ether.

6. The composition of claim 1 where the styrene resin is crystalline polystyrene.

7. The composition of claim 1 where the styrene resin is rubber modified high impact polystyrene.

8. The composition of claim 1 where the styrene resin is a styrene-acrylonitrile copolymer.

9. The composition of claim 1 where the styrene resin is a styrene-acrylonitrile-butadiene copolymer.

10. The composition of claim 1 where the styrene resin is a styrene-coumarine-indene copolymer.

11. A thermoplastic blended composition consisting essentially of (a) from 1.0 to 99 percent of a polyphenylene ether of the formula at least 25 percent polymer units derived from the compound having the formula where R is selected from the group consisting of hydrogen, lower alkyl and halogen, Z is a member selected from the group consisting of hydrogen, lower alkyl and vinyl, and p is a whole integer equal to from 1 to 5.

12. The composition of claim 11 where the polyphenylene ether is poly- (2,6-dimethyl-1,4-phenylene) ether.

13. The composition of claim 12 where the styrene resin is crystalline polystyrene.

14. The composition of claim 12 where the styrene resin is a styrene-acrylonitrile copolymer.

15. The composition of claim 12 where the styrene resin is a styrene-acrylonitrile-bu-tadiene copolymer.

16. The composition of claim 12 Where the styrene resin is a rubber modified high impact polystyrene.

17. The composition of claim 16 where the polyphenylene ether constitutes from 40 to percent of the composition and the polystyrene constitutes from 60 to 15 percent of the composition.

18. A thermoplastic blended composition consisting essentially of from 1.0 to 99 percent of a poly-(2,6- dimethyl-1,4-phenylene) ether and from 99 to 1.0 percent of a styrene resin having at least 25 percent polymer units derived from the compound having the formula Where R is selected from the group consisting of hydro gen, lower alkyl and halogen, Z is a member selected from the group consisting of hydrogen, lower alkyl and vinyl, and p is a whole integer equal to from 1 to 5.

19. The composition of claim 18 Where the styrene resin is crystalline polystyrene.

20. The composition of claim 18 where the styrene resin is a rubber modified high impact polystyrene. R fer nc s Cit d 21. The composition of claim 18 where the styrene resin UNITED STATES PATENTS XS styrene-aciylonitrile copolyrner.

22. The composition of claim 18 where the styrene resin 5 3,225,118 12/1965 Dc M8110 26O'874 is styrene-acrylonitrile-butacliene copolymer. 7/1967 Muddlc 260-4 3,336,761 12/1967 FOX 260874 23. The composition of claim 20 where they polyphenylene ether constitutes from 40 to 85 percent of the com- A "m position and the polystyrene constitutes from 15 to 60 MURRAY TALLKAN Pllmmy Emmmc" percent of the composition, 10 M. I. TULLY Assistant Examiner.

Dedication 3,383,435.Eri0k P. O'z'zek, Ann Arbor, Mich. BLEND OF A POLYPHEN- YLENE ETHER AND A STYRENE RESIN. Patent dated May 14, 1968. Dedication filed Nov. 14, 1979, by the assignee, General Electric Company.

Hereby dedicates to the Publiu daims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,

14, 15, 18, 19, 21 and 22 of said patent.

[Official Gazette, March 18,1980.] 

